A Wide Range of Variations
The most suitable module can be selected to place components from microchips to odd-shaped components, as well as depending on the products and the production volume.
*Heads configuration can be changed after purchase.
Machine configuration
Configuration type | 12 nozzles /12 nozzles | 12 nozzles /8 nozzles | 8 nozzles /8 nozzles | 12 nozzles /3 nozzles | 8 nozzles /3 nozzles | 3 nozzles /3 nozzles | ||
Head combination | A | Type A-2 | Type A-1 | Type A-0 | - | - | - | |
B | - | - | - | - | - | Type A-0 | ||
C | - | - | - | Type C-1 | Type C-0 | - | ||
Direct tray support | One side | D | - | Type D-3 | Type D-2 | Type D-1 | Type D-0 | - |
E | - | - | - | - | - | Type E-0 | ||
Both sides | F | - | - | Type F-2 | - | Type F-1 | Type F-0 | |
Improves actual productivity with lighter high-speed head and new optimization
Actual productivity ( IPC9850 )69 500cph (Type A-2)
Lighter high-speed head and new manufacturing sequence optimization has increased productivity by7% compared to the former optimization model Ver.4.
New high-flexibility 8 nozzles headFurther component handling capability
The generalized Ver.5 (optional) expands existing component range. A wide variety of components, ranging from a 0402 chip to50mm and a large size connector (100× 50mm),have become mountable.The 3D sensor and direct tray feeder can be installed as before providing superior handling capabilities for odd-shaped components.
Improves area productivity with compact feeder carts
200mm decrease in Feeder cart size
·Area productivity has increased by 17%
·Equipment maintenance has improved
*The Compact Feeder Cart has compatibility with Conventional Feeder Cart. Both types of the Feeder Carts can be used at the same time.
Increases placement reliability by the 3D sensor
·Component bring-back check function
·Component thickness measurement function after components are changed
·Nozzle tip check function
Component thickness measurement function after components are changed
High-quality placement for IC component via the 3D sensor
High-speed detection via batch scanning.
Highly versatile unit accurately transfers solder/flux for PoP top packaging/C4 mounting on the bump side
High-speed PoP placement
Maintenance through easy operation
Changeable film thickness
Programmable squeegee gap using dataChangeable on film thickness each component
Max.dimension | |
8 nozzles | 20mm |
3 nozzles | 38mm |
*High-speed heads (12 nozzles) are not supported.
Supply Units
Feeder cart
Type feeder (8 mm~104 mm)
Stick feeder
Automation Units
Automatic tape splicing unit
Feeder maintenance unit
Specifications
Brand | CM602-L |
Model | NM-EJM8A |
Substrate size | L 50 mm × W 50 mm L 510 mm × W 460 mm |
High speed mounting head | 12pcs nozzle |
Mounting speed | 100 000 CPH(0.036 s/chip ) |
Mounting accuracy | ±40 µm/chip(CPK>/=1) |
Component Size | 0402chip *5 L 12 mm × W 12 mm × T 6.5 mm |
Universal mounting head | LS 8cps nozzle |
Mounting speed | 75 000 CPH(0.048 s/chip ) |
Mounting accuracy | ±40 µm/chip,±35 µm/QFP>/= 24 mm,±50 μm/QFP<24 cpk="">/=1) |
Component size | 0402chips *5 L 32 mm × W 32 mm × T 8.5 mm *8Generalized VER.5 option 0402 chip * 5? L 100 mm × W 50 mm × T 15 mm * 6 |
Multi-function placement head | 3pcs nozzle |
Mounting speed | 20 000 CPH(0.18 s/QFP ) |
Mounting accuracy | ±35 µm/QFP(CPK>/=1) |
Component size | 0603 chip L 100 mm × W 90 mm × T 25 mm *7 |
Substrate replacement time | 0.9 s(optimum conditions for substrate lengths below 240 mm) |
Power supply | Three-phase AC 200,220,380,400,420,480 V, 4.0 KVA |
Air pressure source * 1 | 0.49 MPA,170 L /min(A.N.R.) |
Equipment dimensions | W 2 350 mm × D 2 290 mm *2 × H 1 430 mm *3 |
Weight | 3 400 kg |